The 24th European Microelectronics  & Packaging Conference
11-14 September 2023 –
Wellcome Genome Campus, Hinxton
(near Cambridge), UK

Call for Papers / Abstract submission

The deadline for abstract submission was 31 January 2023. If you would like to submit a late abstract for review, please contact the Conference Office at office@empc2023.org.

The content must be original (previously unpublished), non-confidential and non-commercial. The maximum abstract length is 500 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit.

Abstracts can only be submitted as pdf, not in Word or other format. Authors who are submitting more than one abstracts should make a separate submission for each.

Abstracts will be reviewed by a panel of referees and full papers accepted for the conference will be considered for inclusion in IMAPS Source and IEEE Xplore.

If you have questions concerning the abstract upload, please contact the conference office at office@empc2023.org.

  • Abstracts must be submitted in PDF format, no other format will be accepted
  • If using Latex, there is no need to reproduce exactly the layout of this template as it is provided for guidance only.  You may use the fonts you usually work with, but must respect the font size and word limits. 

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