EMPC23
What future do you want to connect with?
The 24th European Microelectronics & Packaging Conference
11-14 September 2023 –
Wellcome Genome Campus, Hinxton
(near Cambridge), UK
Sponsored by
Co-sponsored by
Dr Anne Vanhoestenberghe
EMPC 2023 Conference Chair
EMPC 2023 Conference
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The 24th European Microelectronics Packaging Conference (EMPC 2023) will return to the United Kingdom after 12 years and will be hosted at the Wellcome Genome Campus in Hinxton, near Cambridge from 11 – 14th September 2023. The website provides some initial information on the Conference, including:
- Programme Themes
- Call for Abstracts Timetable
- Conference Schedule
- Exhibition and Sponsorship
- The Venue – Wellcome Genome Campus
- Travel and Accommodation
You will attend presentations and posters from leading companies and academic institutions on emerging trends in electronics devices and associated technology. The event will introduce new materials and opportunities in the packaging of electronic devices and potential applications of systems. We are planning that EMPC 2023 will be run as a face to face event, enabling attendees and exhibitors to network personally in the spacious surrounds of the Wellcome Genome Campus.
EMPC 2023 Venue (Wellcome Genome Campus)
and Accomodation
The 24th European Microelectronics Packaging Conference (EMPC 2023) will return to the United Kingdom after 12 years and will be hosted at the Wellcome Genome Campus in Hinxton, near Cambridge from 11-14th September 2023.
The purpose built event venue with cutting edge audio visual facilities, an auditorium, and the Genome Gallery exhibition space featuring an elliptical steel and glass roof covering 1600m² of new exhibition and breakout spaces. This creates a naturally lit, open and spacious venue space ideal for informal discussion, networking and poster sessions.
The Wellcome Genome Campus is located about 16km South of Cambridge and 40km from Stansted Airport in the United Kingdom. It is accessible by train, plane and car.
Information on accommodation at the Wellcome Genome Campus, Local Hotels and Hotels in Cambridge is available here. Accommodation has also been arranged at Homerton College Cambridge, the venue for the Conference Dinner.
Conference Themes
| Semiconductor Industry Trends |
Packaging Technologies | Performance and Reliability | Design & Process Optimisation |
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| Markets and Developments | Integration | Materials | Design and Test |
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Semiconductor Industry Trends
- Compound
Semiconductors - EV & Automotive
- High speed Communications
- AI and IoT
- Smart Systems
Packaging Technologies
- Emerging Packaging
Technologies - Assembly Processes
- Embedded
Technologies - System in Package
- Equipment Developments
Performance and Reliability
- Reliability test development
- Lifetime Prediction
- Thermal Management
- Failure Modes (e.g. Ageing, Thermal Shock)
- Material Handling
- Cooling Systems
Design & Process Optimisation
- Process Modelling
- System Integration
- Power Density
- Electrical Characterisation
- Packaging Developments
Markets and Developments
- High Performance
Computing - Internet of Things (IoT)
- Automotive
- Aerospace and Defence
- Mobile/Comms
- Medical
- Industrial
Integration
- Single Chip and Multi-chip
- Photonics
- Power Electronics
- MEMS and Sensor
- SiP and Module System
- 5G / 6G / RF / Microwave / mmwave
- Wafer Level Packaging
- 2D and 3D Architectures
Materials
- Emerging Research materials
- Emerging Devices
- Interconnects
- Sustainability
- Substrates
- High Temperature Materials
Design and Test
- Co-Design
- Modelling and Simulation
- Test Technology
- Security
- Design for Recycling and Re-Use
Notes:
- – Tickets inclusive of Conference Dinner
TC = Technical Committee
