EMPC23

What future do you want to connect with?

The 24th European Microelectronics  & Packaging Conference
11-14 September 2023 – Cambridge, UK

Sponsored by

3 Conference Days

Hear about the latest developments in electronic packaging technologies covering a diverse range of topics including industry trends, integration, new materials, thermal management and sustainable electronics.

attractive exhibition and sponsoring packages

Interact with the attendees with several options to suit your budget with shell scheme and table top exhibition spaces and many sponsorship opportunities to raise your profile.

Pre-conference Workshops

Attend in-depth Professional Development Courses (PDC) with acknowledged packaging experts on Monday 11 September 2023 to gain a detailed insight into specific aspects electronics packaging.

Dr Anne Vanhoestenberghe

Dr Anne Vanhoestenberghe

EMPC 2023 Conference Chair

EMPC 2023 Conference

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The 24th European Microelectronics Packaging Conference (EMPC 2023) will return to the United Kingdom after 12 years and will be hosted at the Genome Centre in Hinxton, near Cambridge from 11 – 14th September 2023. The website provides some initial information on the Conference, including:

  • Programme Themes
  • Call for Abstracts Timetable
  • Conference Schedule
  • Exhibition and Sponsorship
  • The Venue – Genome Centre
  • Travel and Accommodation

 

You will attend presentations and posters from leading companies and academic institutions on emerging trends in electronics devices and associated technology. The event will introduce new materials and opportunities in the packaging of electronic devices and potential applications of systems. We are planning that EMPC 2023 will be run as a face to face event, enabling attendees and exhibitors to network personally in the spacious surrounds of the Genome Centre.

Call for Papers / Abstract submission

The content must be original (previously unpublished), non-confidential and non-commercial. The maximum abstract length is 500 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit.

Abstracts can only be submitted as pdf, not in Word or other format. Authors who are submitting more than one abstracts should make a separate submission for each.

Abstracts can be submitted at www.conftool.org/empc2023 starting on October 18, 2022. Please click on the link to set up an account, then upload your abstract and allocate it to the relevant topic heading. The deadline for submission is January 13, 2023.

Abstracts will be reviewed by a panel of referees and full papers accepted for the conference will be considered for inclusion in IMAPS Source and IEEE Xplore.

If you have questions concerning the abstract upload, please contact the conference office at office@empc2023.org.

  • Abstracts must be submitted in PDF format, no other format will be accepted
  • If using Latex, there is no need to reproduce exactly the layout of this template as it is provided for guidance only.  You may use the fonts you usually work with, but must respect the font size and word limits. 

EMPC 2023 Venue – Genome Centre, Cambridge

The 24th European Microelectronics Packaging Conference (EMPC 2023) will return to the United Kingdom after 12 years and will be hosted at the Genome Centre  in Hinxton , near Cambridge from 11-14th September 2023.

The purpose built event venue with cutting edge audio visual facilities, an auditorium, and the Genome Gallery exhibition space featuring an elliptical steel and glass roof covering 1600m² of new exhibition and breakout spaces. This creates a naturally lit, open and spacious venue space ideal for informal discussion, networking and poster sessions.

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The Genome Centre is located about 16km South of Cambridge and 40km from Stansted Airport in the United Kingdom. It is accessible by train, plane and car.

Information on accommodation at the Genome Centre, Local Hotels and Hotels in Cambridge will be made available in due course. Accommodation is also being arranged at Homerton College Cambridge, the venue for the Conference Dinner. 

 

Conference Themes

Semiconductor Industry
Trends
Packaging Technologies Performance and Reliability Design & Process
Optimisation
  • Compound
    Semiconductors
  • EV & Automotive
  • High speed Communications
  • AI and IoT
  • Smart Systems
  • Emerging Packaging
    Technologies
  • Assembly Processes
  • Embedded
    Technologies
  • System in Package
  • Equipment Developments
  • Reliability test development
  • Lifetime Prediction
  • Thermal Management
  • Failure Modes (e.g. Ageing, Thermal Shock)
  • Material Handling
  • Cooling Systems
  • Process Modelling
  • System Integration
  • Power Density
  • Electrical Characterisation
  • Packaging Developments
Markets and Developments Integration Materials Design and Test
  • High Performance
    Computing
  • Internet of Things (IoT)
  • Automotive
  • Aerospace and Defence
  • Mobile/Comms
  • Medical
  • Industrial
  • Single Chip and Multi-chip
  • Photonics
  • Power Electronics
  • MEMS and Sensor
  • SiP and Module System
  • 5G / 6G / RF / Microwave / mmwave
  • Wafer Level Packaging
  • 2D and 3D Architectures
  • Emerging Research materials
  • Emerging Devices
  • Interconnects
  • Sustainability
  • Substrates
  • High Temperature Materials
  • Co-Design
  • Modelling and Simulation
  • Test Technology
  • Security
  • Design for Recycling and Re-Use

EMPC 2023 – Exhibition

EMPC 2023 – Exhibition Stands

The Exhibition Package will include options for both Shell Scheme and Table Top exhibitor spaces.

As an exhibitor, you will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers. Our opening hours are arranged to give exhibitors maximum exposure, and social events are planned in the exhibition space to encourage all delegates to meet and mingle formally and informally.

 

Silver Exhibitors Bronze Exhibitors Table Top Package
  • Logo in conference programme
  • 1 full conference ticket
  • 2m x 1m table top
₤ 3,500 (exc VAT) ₤ 2,500 (exc VAT) ₤ 1,000 (exc VAT) 

This price covers the main exhibition stand space and structure. Optional extras can be ordered through the shell scheme provider.

EMPC 2023 – Additional Extra Order Form – SILVER
EMPC 2023 – Additional Extra Order Form – BRONZE

Please contact us at office@empc2023.org if you are interested in booking an exhibitor slot.

EMPC 2023 Conference Schedule

Day Morning Afternoon Evening
Sunday ELC Meeting
Monday Short Courses Short Courses Buffet / Bar at Genome Centre
Tuesday Conference Day 1 Posters / Pizza
Wednesday Conference Day 2 Delegates Dinner in Homerton College, Cambridge
Thursday Conference Day 3 Conference Close Depart

Sponsor Packages

A sponsorship of EMPC 2023 offers companies and organisations an excellent opportunity to raise their profile in the important field of microelectronics. The event provides a platform to showcase your international projects and reach out to customers and other interested parties from all over the world. Multiply your visibility by being promoted together with Europe’s most outstanding microelectronic packaging event in 2023! Please contact us at office@empc2023.org if you are interested in booking a sponsoring package.

Sponsorship Level Availability Price (exc VAT) 
Platinum Sponsor 1 Sponsor SOLD
Gold Sponsor Up to 3 Sponsors SOLD

Full Page Advert in Final Programme

(A4 in Online Booklet + A6 in Printed Booklet)

up to 2 Sponsors £750 each
All Coffee and Lunch Break up to 6 Sponsors £1,000 each
Welcome Reception up to 6 Sponsors £1,000 each
Conference Dinner
(Logo on tables and pull-up banner in entrance)
up to 3 Sponsors £3,000 each
Lanyards Single sponsor £2,000

Conference Attendee Prices

Attendee Ticket Type – (1) Early Bird Price until 31/5/23 (2)
(exc VAT)
IMAPS – Members £665
IMAPS – Members (Speakers + TC) £465
Non-Members £765
Non-Members (Speakers + TC) £565
Students £365

 

Notes:

  1. – Tickets inclusive of Conference Dinner
  2. – Prices after 31/5/23 will be subject to review

TC = Technical Committee

Dinner and Accommodation at Homerton College, Cambridge

Source: Google Maps

A Conference Dinner is being organised at Homerton College Cambridge on Wednesday 13 September 2023, where there will also be the opportunity to stay for the duration of the Conference, with dedicated transport to and from the Genome Centre.

Homerton College Cambridge is located on the south side of Cambridge, but with easy access to the Cambridge railway station (10 minutes walk) and the historic University Centre (20 minutes walk). The College has an impressive Victorian façade, spacious landscaped gardens, ample car parking and ensuite single, twin and double bedrooms.

The EMPC 2023 Conference Team is arranging for attendees to have the chance to book accommodation at Homerton College at negotiated rates with rooms reserved until 31st May 2023. Booking will be available in late 2022.

Details of other hotels and local accommodation will be provided in due course.

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