EMPC23

Award Recipients

Awards for Oral Presentations

Best Paper

Development and Characterizations of Fine Pitch Flip-chip Interconnection Using Silver Sintering

Julie Gougeon^1,2, Céline Feautrier¹, Laurent Mendizabal¹, Jean-Charles Souriau¹, Mona Tréguer-Delapierre², Edouard Deschaseau¹, Rémi Franiatte¹
1: CEA Leti, Grenoble, France
2: ICMCB, Bordeaux, France

Highly Commended Papers

Research of Chip Placement Accuracy for Fan-Out WLP Using A Novel Self-Assembly Stage

Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu
LINTEC Corporation, Japan

Development of a Stretchable and Removable Electrical Interconnection Solution for Ultra-thin Electronic Components

Auriane Despax-Ferreres¹, Pascal Tiquet¹, Jean-Charles Souriau², Vincent Jousseaume², Julia De Girolamo¹
1: Univ. Grenoble Alpes, CEA Liten, Grenoble, France
2: Univ. Grenoble Alpes, CEA Leti, Grenoble, France

Awards for Poster Presentations

Best Poster

Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate

Chuantong Chen¹, Ran Liu¹, Koji Kobayashi², Hideyo Osanai², Zheng Zhang¹, Katsuaki Suganuma¹
1: Osaka University, Osaka, Japan

2: DOWA POWER DEVICE Co., Ltd

Highly Commended Poster

Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Martin Hirman, Jiří Navrátil, Andrea Benešová, František Steiner
University of West Bohemia, Czech Republic